Basic Info.
Flame Retardant Properties
V0
Insulation Materials
Epoxy Resin
Material
Fiberglass Epoxy
Product Description
High Quality But Cheappest Printed Circuit Board Manufacturing Process Capability:
Item
Manufacture Capability
Material
FR-1, FR-2, FR-4, CEM-1,CEM-3
Thickness
Min.
0.4µm
Max.
5.0µm
Copper Thickness
Min.
35µm
Max.
240µm
Min. Line Width
0.18mm
Min. Line Spacing
0.2mm
Hole
Min.
0.2mm
Max.
5.0mm
Min. Size of the Slot
0.6mm×1.5mm
Tolerance of Normal Hole
±0.05mm
Tolerance of Hole Location
Min. ±0.08mm
Min. EDGE To Conductor
0.3mm
Min. Clearance To Holes
0.3mm
Min. Annular Ring
Paper Phenolic
Min. 0.4mm
CEM-1/CEM-3
Min. 0.35mm
With NC Drilling Hole
Min. 0.2mm
Solder Resist Thickness
Min. 10µm
Legend&Marking Min. Width
0.2mm
Legend Color
Black, White, Blue, Green
Surface Finish
HASL(Hot Air Solder Leveling)
ENIG(Electroless Nickel/Immersion Gold)
Immersion Silver
OSP(Organic Solderability Preservatives)
Thickness of Peelable Solder resist
Min.
0.2mm
Max.
0.35mm
Thickness of HASL
Min.
1.3µm
Max.
50µm
Min. Size of The Board
120mm×120mm
Out Line Dimension Tolerance of the Board
±0.1mm
V-CUT Panel Size
Min.
50mm
Max.
450mm
High Quality But Cheappest Printed Circuit Board Flow Chart:
Cut Lamination → Drilling → Dry Film Lamination → Exposure → Developing → Pattern Plating → Stripping→ Etching → Solder Mask → Exposure → Developing → Legend → UV Cure → HASL → Profile → E-test → Final Visual Inspection → Packing → Shipping
High Quality But Cheappest Printed Circuit Board Material:
PCB Material FR-1 Paper+Phenolic Resin+Copper Foil
FR-1 Features:
1.In high temperature warpage and twist both less than 1.0%
2.Suitable for punching at 40~70ºC
3.High CTI Value(CTI Over 600V need special request)
FR-1 General Properties:
Test Item
Unit
Test Condition
Testing Method
Specification
Typical Value
Solder Resistance
Sec
A
JIS C 6481
≥10
20~30
Heat Resistance
----
130ºC,30min
JIS C 6481
No Change
No Change
Peel Strength(Copper Foil 35µm)
Kgf/cm
A260ºC/10 Sec
JIS C 6481
≥1.2
1.7~2.01.6~1.9
Flexural Strength
Lengthwise
Kgf/mm2
A
JIS C 6481
≥8
15~17
Crosswise
≥8
14~15
Volume Resistivity
Ω.-cm
C-96/20/65C-96/20/65+C-96/40/90
JIS C 6481
5X1095X108
1.0X1012 ~ 10131.0X1012 ~ 1013
Surface Resistivity
Adhesive Side
Ω
C-96/20/65C-96/20/65+C-96/40/90
JIS C 6481
1X10101X109
1.0X1011 ~ 10121.0X1010 ~ 1011
Laminate Side
C-96/20/65C-96/20/65+C-96/40/90
1X1091X107
1.0X1010 ~ 10111.0X109 ~ 1010
Insulation Resistance
Ω
C-96/20/65C-96/20/65+D-2/100
JIS C 6481
1X1091X106
1.0X1011 ~ 10121.0X108 ~ 109
Chemical Resistance
---
3% NaOH 40ºC 3min
JIS C 6481
No Change
No Change
Boiled in trichloroethylene for 3 min
JIS C 6481
No Change
No Change
Moisture Absorption
%
E-24/50+D-24/23
JIS C 6481
≤2
0.8~1.0
Flammability
Rating
A
UL94
UL94 V-0
V-0
Dielectric Constant(1 MHz)
---
C-96/20/65C-96/20/65+D-24/23
JIS C 6481
≤5.5≤6.0
4.0~5.04.5~5.5
Dissipation Factor
---
C-96/20/65C-96/20/65+D-24/23
JIS C 6481
≤0.05≤0.1
0.025~0.0350.045~0.055
CTI Value
V
0.1% NH 4CL
IEC 112
≥175
≥175
Punching Temperature
ºC
A
GB/T4722
40-70
40-70
Remarks: Typical values for reference only . Stand values according to JIS-C-6485
A = Keep the specimen originally without any process;
C = Temperature and humidity conditioning;
D = Immersing in distilled water with temperature control;
E = Temperature conditioning.
PCB Material FR-2 Paper+Phenolic Resin+Copper Foil
FR-2 Features:
1.Low cost but with wide range of application
2.Superior heat and humidity resistance
3.Suitable for punching at 40~70ºC
4.Warpage and twist are small and stable
5.Excellent dimensional stability
FR-2 General Properties:
Test Item
Unit
Test Condition
Testing Method
Specification
Typical Value
Solder Resistance
Sec
A
JIS C 6481
≥10
20~30
Heat Resistance
---
130ºC 30min
JIS C 6481
No Change
No Change
Peel Strength(Copper Foil 35µm)
Kgf/cm
A250ºC/10Sec
JIS C 6481
≥12
1.8~2.01.7~1.9
Flexural Strength
Lengthwise
Kgf/mm2
A
JIS C 6481
≥8
14~16
Crosswise
≥8
13~14
Volume Resistivity
Ω-cm
C-96/20/65C-96/20/65+C-96/40/90
JIS C 6481
5X10105X109
1.0X1012~10131.0X1012~1013
Surface Resistivity
Adhesive Side
Ω
C-96/20/65C-96/20/65+C-96/40/90
JIS C 6481
1X10121X1011
1.0X1012~10131.0X1011~1012
Laminate Side
C-96/20/65C-96/20/65+C-96/40/90
1X10115X108
1.0X1011~10121.0X1010~1011
Insulation Resistance
Ω
C-96/20/65C-96/20/65+D-2/100
JIS C 6481
1X10111X108
1.0X1011~10121.0X109~1010
Chemical Resistance
---
3% NaOH 40ºC 3min
JIS C 6481
No Change
No Change
Boiled in trichloroethylene for 3 min
JIS C 6481
No Change
No Change
Moisure Absorption
%
E-24/50+D-24/23
JIS C 6481
≤0.75
0.5~0.7
Flammability
Rating
A
UL94
UL94 V-0
V-0
Dielectric Constant(1 MHz)
---
C-96/20/65C-96/20/65+D-24/23
JIS C 6481
≤5.0≤5.3
4.0~5.04.5~5.5
Dissipation Factor
---
C-96/20/65C-96/20/65+D-24/23
JIS C 6481
≤0.04≤0.05
0.025~0.0350.035~0.045
CTI Value
V
0.1% NH4CL
IEC 112
≥175
≥200
Punching Temperature
ºC
A
GB/T4722
40~70
40~70
Remarks: Typical values for reference only . Stand values according to JIS-C-6485
A = Keep the specimen originally without any process;
C = Temperature and humidity conditioning;
D = Immersing in distilled water with temperature control;
E = Temperature conditioning.
PCB Material CEM-1 Paper+ Fiberglass Fabric +Eoxy Resin+Copper Foil
CEM-1 Features:
Excellent punching property,Suitable for punching at 45ºC~70ºC
Good thermal reliability and moisture resistance,lower warpage
Good mechanical properties and electrical properties.
CEM-1 General Properties:
Test Item
Unit
Test Method(IPC-TM-650)
Test Condition
Specification(IPC-4101C)
Typical Value
Peel Strength(1 oz.)
N/mm
2.4.8
125ºC
---
1.65
Float 260ºC/10Sec
≥1.05
1.6/1.45
Thermal Stress
Sec
2.4.13.1
Float 260ºC/unetched
≥10
25
Bow/Twist
%
2.4.22.1
A
≤1.5
0.3/0.4
Flexural Strength
N/mm2
2.4.4
Warp
≥242
420
Fill
≥172
290
Flammability
Rating
UL94
UL-94
UL94 V-0
V-0
Surface Resistivity
MΩ
2.5.17.1
C-96/35/90
≥1.0X104
1.0X107
Volume Resistivity
MΩ-cm
2.5.17.1
C-96/35/90
≥1.0X106
1.0X108
Z-Axis Expansion
Ppm/ºC
2.4.24
E-2/105 TMA
---
100/320
%
---
6.0
Dielectric Constant
---
2.5.5.2
Etched/@1 MHz
≤5.4
4.6
Loss Tangent
---
2.5.5.2
Etched/@1 MHz
≤0.035
0.023
Arc Resistance
Sec
2.5.1
D-48/50+D-0.5/23
≥60
125
Moisture Absorption
%
2.6.2.1
D-24/23
≤0.5
0.15
Comparative Tracking Index
V
IEC60112
Etched/0.1%NH4CL
≥175
175/300/600
Remarks: Typical values for reference only. Specimen Thickness:1.6mm 1/0
A = Keep the specimen originally without any process;
C = Temperature and humidity conditioning;
D = Immersing in distilled water with temperature control;
E =Temperature conditioning
High Quality But Cheappest Printed Circuit Board Applications:
Home Electrical Appliance, Display, Power Supply, Keyboard, Instrument, Game Machine, Ultrasonic Machine