Basic Info.
Flame Retardant Properties
V0
Insulation Materials
Epoxy Resin
Material
Fiberglass Epoxy
Product Description
High Quality But Cheappest Printed Circuit Board Manufacturing Process Capability:ItemManufacture CapabilityMaterialFR-1, FR-2, FR-4, CEM-1,CEM-3ThicknessMin.0.4µmMax.5.0µmCopper ThicknessMin.35µmMax.240µmMin. Line Width0.18mmMin. Line Spacing0.2mmHoleMin.0.2mmMax.5.0mmMin. Size of the Slot0.6mm×1.5mmTolerance of Normal Hole±0.05mmTolerance of Hole LocationMin. ±0.08mmMin. EDGE To Conductor0.3mmMin. Clearance To Holes0.3mmMin. Annular RingPaper PhenolicMin. 0.4mmCEM-1/CEM-3Min. 0.35mmWith NC Drilling HoleMin. 0.2mmSolder Resist ThicknessMin. 10µmLegend&Marking Min. Width0.2mmLegend ColorBlack, White, Blue, GreenSurface FinishHASL(Hot Air Solder Leveling)ENIG(Electroless Nickel/Immersion Gold)Immersion SilverOSP(Organic Solderability Preservatives)Thickness of Peelable Solder resistMin.0.2mmMax.0.35mmThickness of HASLMin.1.3µmMax.50µmMin. Size of The Board120mm×120mmOut Line Dimension Tolerance of the Board±0.1mmV-CUT Panel SizeMin.50mmMax.450mm High Quality But Cheappest Printed Circuit Board Flow Chart:Cut Lamination → Drilling → Dry Film Lamination → Exposure → Developing → Pattern Plating → Stripping→ Etching → Solder Mask → Exposure → Developing → Legend → UV Cure → HASL → Profile → E-test → Final Visual Inspection → Packing → ShippingHigh Quality But Cheappest Printed Circuit Board Material:PCB Material FR-1 Paper+Phenolic Resin+Copper FoilFR-1 Features:1.In high temperature warpage and twist both less than 1.0%2.Suitable for punching at 40~70ºC3.High CTI Value(CTI Over 600V need special request)FR-1 General Properties:Test ItemUnitTest ConditionTesting MethodSpecificationTypical ValueSolder ResistanceSecAJIS C 6481≥1020~30Heat Resistance----130ºC,30minJIS C 6481No ChangeNo ChangePeel Strength(Copper Foil 35µm)Kgf/cmA260ºC/10 SecJIS C 6481≥1.21.7~2.01.6~1.9Flexural StrengthLengthwiseKgf/mm2AJIS C 6481≥815~17Crosswise≥814~15Volume ResistivityΩ.-cmC-96/20/65C-96/20/65+C-96/40/90JIS C 64815X1095X1081.0X1012 ~ 10131.0X1012 ~ 1013Surface ResistivityAdhesive SideΩC-96/20/65C-96/20/65+C-96/40/90JIS C 64811X10101X1091.0X1011 ~ 10121.0X1010 ~ 1011Laminate SideC-96/20/65C-96/20/65+C-96/40/901X1091X1071.0X1010 ~ 10111.0X109 ~ 1010Insulation ResistanceΩC-96/20/65C-96/20/65+D-2/100JIS C 64811X1091X1061.0X1011 ~ 10121.0X108 ~ 109Chemical Resistance---3% NaOH 40ºC 3minJIS C 6481No ChangeNo ChangeBoiled in trichloroethylene for 3 minJIS C 6481No ChangeNo ChangeMoisture Absorption%E-24/50+D-24/23JIS C 6481≤20.8~1.0FlammabilityRatingAUL94UL94 V-0V-0Dielectric Constant(1 MHz)---C-96/20/65C-96/20/65+D-24/23JIS C 6481≤5.5≤6.04.0~5.04.5~5.5Dissipation Factor---C-96/20/65C-96/20/65+D-24/23JIS C 6481≤0.05≤0.10.025~0.0350.045~0.055CTI ValueV0.1% NH 4CLIEC 112≥175≥175Punching TemperatureºCAGB/T472240-7040-70Remarks: Typical values for reference only . Stand values according to JIS-C-6485A = Keep the specimen originally without any process;C = Temperature and humidity conditioning;D = Immersing in distilled water with temperature control;E = Temperature conditioning.PCB Material FR-2 Paper+Phenolic Resin+Copper FoilFR-2 Features:1.Low cost but with wide range of application2.Superior heat and humidity resistance3.Suitable for punching at 40~70ºC4.Warpage and twist are small and stable5.Excellent dimensional stabilityFR-2 General Properties:Test ItemUnitTest ConditionTesting MethodSpecificationTypical ValueSolder ResistanceSecAJIS C 6481≥1020~30Heat Resistance---130ºC 30minJIS C 6481No ChangeNo ChangePeel Strength(Copper Foil 35µm)Kgf/cmA250ºC/10SecJIS C 6481≥121.8~2.01.7~1.9Flexural StrengthLengthwiseKgf/mm2AJIS C 6481≥814~16Crosswise≥813~14Volume ResistivityΩ-cmC-96/20/65C-96/20/65+C-96/40/90JIS C 64815X10105X1091.0X1012~10131.0X1012~1013Surface ResistivityAdhesive SideΩC-96/20/65C-96/20/65+C-96/40/90JIS C 64811X10121X10111.0X1012~10131.0X1011~1012Laminate SideC-96/20/65C-96/20/65+C-96/40/901X10115X1081.0X1011~10121.0X1010~1011Insulation ResistanceΩC-96/20/65C-96/20/65+D-2/100JIS C 64811X10111X1081.0X1011~10121.0X109~1010Chemical Resistance---3% NaOH 40ºC 3minJIS C 6481No ChangeNo ChangeBoiled in trichloroethylene for 3 minJIS C 6481No ChangeNo ChangeMoisure Absorption%E-24/50+D-24/23JIS C 6481≤0.750.5~0.7FlammabilityRatingAUL94UL94 V-0V-0Dielectric Constant(1 MHz)---C-96/20/65C-96/20/65+D-24/23JIS C 6481≤5.0≤5.34.0~5.04.5~5.5Dissipation Factor---C-96/20/65C-96/20/65+D-24/23JIS C 6481≤0.04≤0.050.025~0.0350.035~0.045CTI ValueV0.1% NH4CLIEC 112≥175≥200Punching TemperatureºCAGB/T472240~7040~70Remarks: Typical values for reference only . Stand values according to JIS-C-6485A = Keep the specimen originally without any process;C = Temperature and humidity conditioning;D = Immersing in distilled water with temperature control;E = Temperature conditioning.PCB Material CEM-1 Paper+ Fiberglass Fabric +Eoxy Resin+Copper FoilCEM-1 Features:Excellent punching property,Suitable for punching at 45ºC~70ºCGood thermal reliability and moisture resistance,lower warpageGood mechanical properties and electrical properties.CEM-1 General Properties:Test ItemUnitTest Method(IPC-TM-650)Test ConditionSpecification(IPC-4101C)Typical ValuePeel Strength(1 oz.)N/mm2.4.8125ºC---1.65Float 260ºC/10Sec≥1.051.6/1.45Thermal StressSec2.4.13.1Float 260ºC/unetched≥1025Bow/Twist%2.4.22.1A≤1.50.3/0.4Flexural StrengthN/mm22.4.4Warp≥242420Fill≥172290FlammabilityRatingUL94UL-94UL94 V-0V-0Surface ResistivityMΩ2.5.17.1C-96/35/90≥1.0X1041.0X107Volume ResistivityMΩ-cm2.5.17.1C-96/35/90≥1.0X1061.0X108Z-Axis ExpansionPpm/ºC2.4.24E-2/105 TMA---100/320%---6.0Dielectric Constant---2.5.5.2Etched/@1 MHz≤5.44.6Loss Tangent---2.5.5.2Etched/@1 MHz≤0.0350.023Arc ResistanceSec2.5.1D-48/50+D-0.5/23≥60125Moisture Absorption%2.6.2.1D-24/23≤0.50.15Comparative Tracking IndexVIEC60112Etched/0.1%NH4CL≥175175/300/600Remarks: Typical values for reference only. Specimen Thickness:1.6mm 1/0A = Keep the specimen originally without any process;C = Temperature and humidity conditioning;D = Immersing in distilled water with temperature control;E =Temperature conditioningHigh Quality But Cheappest Printed Circuit Board Applications:Home Electrical Appliance, Display, Power Supply, Keyboard, Instrument, Game Machine, Ultrasonic Machine
Address:
No.789 Xiangcheng Road, Suzhou, Jiangsu, 215131,China
Business Type:
Manufacturer/Factory, Trading Company
Business Range:
Electrical & Electronics, Manufacturing & Processing Machinery, Tools & Hardware
Management System Certification:
ISO 9000
Company Introduction:
After years of hard work, ALB Technology has become one of biggest manufacturer of high performance single side PCB, double and multilayer PCB, HDI, FPC. SMT, weld, assembley and design manufacturer trusted by the international and domestic clients. Our PCB products are widely applied to telecommunication, industrial control, computer, spaceflight, aircraft and weapons and other areas.
Our company contorls the quality process management based on ISO9001 quality control system, and certified by ISO14001 environmental management system, OHSAS18001 occupational health and safety management system, our products have been passed the United States UL certifiaction. The company also promotes ISO/TS16949 quality management system, QC080000 hazardous materials management system, and always supports quality, production, human resources and other effective management etc. Through the continuous efforts from all the staff, our internation sales has had a great developments all over the country and also covers markets like Southeast Asia, North America, Russia, and Korea, etc.
